Intel has unveiled brand new packaging for the upcoming 11th Gen Core i9 Rocket Lake-S desktop CPUs. With the updating of the company’s logo and other identities, Intel is also changing up the packaging style for its newest desktop CPU lineup.
The new packaging features Intel’s new logo and a new box design for the flagship i9 11900K CPU. It a simple design that should definitely catch the attention of consumers while you are at a store. Of course, each box will have a sticker featuring the exact CPU model name.
Below we have showcased all the new packaging for the i9 processors that will come in the 11th gen Rocket Lake lineup. All pictures courtesy Videocardz.
Intel Core i9-11900K
Intel Core i9-11900KF
Intel Core i9-11900
Intel Core i9-11900F
The Core i9-11900K is the flagship processor of the upcoming Intel 11th Gen Rocket Lake-S CPU series. It is based on the Cypress cove architecture which is the biggest CPU architectural upgrade in over 5 years. Ever since the 6th Generation Skylake CPUs, all Intel CPUs up till the 10th Generation Comet Lake CPUs used the same identical chip architecture based on the 14nm process node, with small refinements along the way.
The Intel Core i9-11900K will have 8 cores and 16 threads, 16 MB of L3 cache (2 MB per core), and 4 MB of L2 cache (512 KB per core). In terms of clocks, the CPU has a base frequency of 3.5 GHz but as for boost, the CPU will feature a maximum boost clock of 5.3 GHz (1-core) while the all-core boost frequency will be maintained at 4.8 GHz, powered by Intel Thermal Velocity Boost. Intel shared some official benchmarks of its new flagship model back at CES 2021 however we have also seen some leaked benchmarks here and here which put it against its competition. Intel has also recently accidentally leaked a special edition of the Core i9-10900KS processor.
Image Credit: Intel
The i9-11900K will have a 1st stage power limit of 125W which is standard for a flagship Intel SKU and the 2nd stage power limit or PL2 is rated at 250W.
